AUTHORS: Reshmi Maity, Santanu Maity, Niladri Pratap Maity
Download as PDF
ABSTRACT: In this paper a rectangular silicon nitride membrane capacitive micromachined ultrasonic transducer (CMUT) has been proposed to suit best for medical imaging applications. Investigations have been brought up using single cell rectangular architecture as well as array of the cells through three dimensional finite element method (FEM) model. The maximum and minimum displacements result with single cell and array of cells have been measured. The force is evaluated as 16.894 µN. The relative investigation of membrane displacements of array rectangular geometries on a lone substrate accumulated with dissimilar distances (1 μm, 2 μm, 5 μm, and 8 μm) between each other is also carried out.
KEYWORDS: Sensor, CMUT, Ultrasonic, Medical Imaging, FEM, MEMS
REFERENCES:
[1] J. Miao, H, Wang, P. Li, W. Shen, C. Xue, J.
Xiong, Glass-SOI-Based Hybrid-Bonded
Capacitive Micromachined Ultrasonic
Transducer With Hermetic Cavities for
Immersion Applications, IEEE Journal of
Microelectromechanical Systems, Vol. 25, No.
5, 2016, pp. 976-986.
[2] R. Maity, N. Maity, K. Srinivasa Rao, K. Guha,
S. Baishya, A New Compact Analytical Model
of Nano-Electro-Mechanical-Systems Based
Capacitive Micromachined Ultrasonic
Transducers for Pulse Echo Imaging, Journal
of Computational Electronics, Vol. 17, No. 3,
2018, pp. 1334-1342
[3] R. Maity, N. Maity, R. Thapa, S. Baishya, An
Improved Analytical and Finite Element
Method Model of Nanoelectromechanical
System Based Micromachined Ultrasonic
Transducers, Microsystem Technologies, Vol.
23, No. 6, 2017, pp. 2163-2173.
[4] D. Mills, S. Smith, Multi-layered PZT/polymer
composites to increase signal-to-noise ratio and
resolution for medical ultrasound transducers,
IEEE Transactions on Ultrasonics,
Ferroelectrics, and Frequency Control, Vol.
46, No. 4, 1999, pp. 961–971.
[5] K. Hohlfeld, A. Michaelis, S. Gebhardt,
Piezoelectric transducers on the basis of freeformed PZT components, IEEE Proc. Int.
Symp. Applications of Ferroelectric, 2013, pp.
279–282.
[6] R. Maity, N. Maity, S. Baishya, Circular
Membrane Approximation Model with the
Effect of the Finiteness of the Electrode’s
Diameter of MEMS Capacitive Micromachined
Ultrasonic Transducers, Microsystem
Technologies, Vol. 23, No. 8, 2017, pp. 3513-
3524.
[7] M. Pal, N. P. Maity, R. Maity, An improved
displacement model for micro-electromechanical-system based ultrasonic transducer,
Microsystem Technologies, 2019, pp. 1-8,
Online Published 8th March, 2019.
doi.org/10.1007/s00542-019-04387-2.
[8] R. Maity, N. P. Maity, K. Guha, S. Baishya,
Analysis of fringing capacitance effect on the
performance of micro-electromechanicalsystem based micromachined ultrasonic
transducer, IET Micro and Nano Letters, Vol
13, No. 6, 2018, pp. 872-877.
[9] W. Zhang, H. Zhang, S. Jin, Z. Zeng, A TwoDimensional CMUT Linear Array for
Underwater Applications: Directivity Analysis
and Design Optimization, Journal of Sensors,
Vol. 2016, Article ID: 5298197, 2016, 1-8.
[10] Y. Qiu, J. V. Gigliotti, M. Wallace, F. Griggio,
C. E. M. Demore, S. Cochram, S. trolierMcKinstry, Piezoelectric micromachined
ultrasound transducer (PMUT) arrays for
integrated sensing, actuation and imaging,
Sensors, Vol. 15, No. 4, 2015, pp. 8020-8041.
[11] T. L. Christiansen, M. F. Rasmussen, J. P.
Bagge, L. N. Moesner, J. A. Jensen, E. V.
Thomsen, 3-D imaging using row-columnaddressed arrays with integrated apodization -
part ii: transducer fabrication and experimental
results, IEEE Transactions on Ultrasonics,
Ferroelectrics, and Frequency Control, Vol.
62, No. 5, 2015, pp. 959–971.
[12] A. Lei, S. E. Diederichsen, S. M. Hansen, M.
B. Stuart, J. P. Bagge, J. A. Jensen, E. V.
Thomsen, Elimination of second-harmonics in
cmuts using square pulse excitation, IEEE
Ultrasonics Symposium, 2016, pp. 1–4.
[13] Y. Huang, A. S. Ergun, E. Hæggstr¨om, M. H.
Badi, B. T. Khuri-Yakub, Fabricating
capacitive micromachined ultrasonic
transducers with wafer-bonding technology.
IEEE Journal of Microelectromechanical
System, Vol. 12, No. 2, 2003, pp. 128–137.
[14] R. Maity, N. Maity, K. Guha, S. Baishya,
Analysis of spring softening effect on the
collapse voltage of capacitive MEMS
ultrasonic transducers, Microsystem
Technologies, 2018, pp. 1-9, Online published
21st July 2018. doi.org/10.1007/s00542-018-
4040-x.
[15] Ö. Oralkan, A. S. Ergun, J. A. Johnson, M.
Karaman, U. Dermirci, K. Kaviani, T. H. Lee,
B. T. Khuuri-Yakub, Capacitive
micromachined ultrasonic transducers: next
generation arrays for acoustic imaging?. IEEE
Transactions on Ultrasonics, Ferroelectrics,
and Frequency Control, Vol. 49, No. 11, 2002,
pp. 1596–1610.
[16] A. Caronti, G. Caliano, R. Carotenuto, A.
Savoia, M. Pappalardo, E. Cianci, V. Foglietti,
Capacitive micromachined ultrasonic
transducer (CMUT) arrays for medical
imaging, Microelectronics Journal, Vol. 37,
2006, pp. 770-777.
[17] K. Park, M. Kupnik, H. Lee, B. T. KhuriYakub, I. Wygant, Modeling and Measuring
the Effects of Mutual Impedance on Multi-Cell
CMUT Configurations, IEEE Ultrasonics
Symposium, 2010, pp. 431-434.
[18] A. Caronti, A. Savoia, G. Caliano, M.
Pappalardo, Acoustic Coupling in Capacitive
Microfabricated Ultrasonic Transducers:
Modeling and Experiments. IEEE Transactions
on Ultrasonics, Ferroelectrics, and Frequency
Control, Vol. 52, No. 12, 2005, pp. 2220-2234.
[19] D. Lin, R. Wodnicki, X. Zhuang, C. Woychik,
K. Thomenius, R. Fisher, D. Mills, A. Byun,
W. Burdick, P. Khuri-Yakub, B. Bonitz, T.
Davies, G. Thomas, B. Otto, M. Topper, T.
Fritzsch, O. Ehrmann, Packaging and Modular
Assembly of Large-Area and Fine-Pitch 2-D
Ultrasonic Transducer Arrays, IEEE
Transactions on Ultrasonics, Ferroelectrics,
and Frequency Control, Vol. 60, No. 7, 2013,
pp. 1356-1375.
[20] N. Maity, R. Maity, R. Thapa, S. Baishya, A
Tunneling Current Density model for Ultra
Thin HfO2 High-k Dielectric Material Based
MOS Devices, Superlattices and
Microstructures, Vol. 95, 2016, pp. 24-32.
[21] N. Maity, R. Maity, S. Baishya, Voltage and
Oxide Thickness Dependent Tunneling Current
Density and Tunnel Resistivity Model:
Application to High-k Material HfO2 Based
MOS Devices, Superlattices and
Microstructures, Vol. 111, 2017, pp. 628-641.
[22] N. Maity, R. Maity, R. Thapa, S. Baishya,
Study of Interface Charge Densities for ZrO2
and HfO2 Based Metal Oxide Semiconductor
Devices, Advances in Material Science and
Engineering, Vol. 2014, 2014, pp. 1-6.
[23] N. Maity, R. Maity, S. Baishya, A Tunneling
Current Model with a Realistic Barrier for Ultra
Thin High-k Dielectric ZrO2 Material based
MOS Devices, Silicon, Vol. 10, No. 4, 2018,
pp. 1645-1652.
[24] G. Gurun, C. Tekes, J. Zahorian, T. Xu, S.
Satir, M. Karaman, J. Hasler, F. Degertekin,
Single-Chip CMUT-on-CMOS Front-End
System for Real-Time Volumetric IVUS and
ICE Imaging, IEEE Transactions on
Ultrasonics, Ferroelectrics, and Frequency
Control, Vol. 61, No. 2, 2014, pp. 239-250.
[25] M. H. Badi, G. G. Yaralioglu, Capacitive
Micromachined Ultrasonic Lamb Wave
Transducers Using Rectangular Membranes,
IEEE Transactions on Ultrasonics,
Ferroelectrics, and Frequency Control, Vol.
50, No. 9, 2003, pp. 1191-1203.